Product Description

LGA 1150/1155/1156 Sunflower Extrusion heat sink

1 Product Size:92*92*63mm

2 Product Wight:410g

3 Appliciation:  Intel® Core™ i7-2600, i5-2500 series Intel® Core™ i3 & i5,Xeon

4 Fan Size:95*95*25mm

5 Connector:4pins with PWM function

6 Crafts:Extrusion

7 Fan Speed:3500 RPM

Payment Terms︰ Western Union,Paypal

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