Manufacture Intel 775/776 1.5U copper skived/extrused heat sink radiator

Manufacture Intel 775/776 1.5U copper skived/extrused heat sink radiator

Model No.︰NT2ACU7-F6-01

Brand Name︰Coonong

Country of Origin︰-

Unit Price︰-

Minimum Order︰-

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Product Description

Application: 1.5U Server&Up,workastion&Tower desktop solution,Power Supply,CPU/ Telecom, Wireless/Network,Security, Industrial, Power/Energy/Equipment
Socket Type: LGA 775
Application platform: Pentium®D Pentium® 4 & Xeon® 3000
Features: 1.  Pure Copper skiving crafts
2. 50*50*4mm stairs can absorb thermal from CPU directly,and transmit it to heat sink.
3.  PWM function can extened the life of fan,fan combine with heat sink ,can make the disspation effect more better.
Mounting way: Screw+ Spring
Product Size: 90*88*52mm
Weight:  524g(Note:If Weight of Heat sink ≥500g,
Pls do not install in CPU in case of damage.
Thermally conductive material  AD66(Thermally conductivity >4.0)
Back Plate: NA
Surface Finish: anodizing, electrophoresis, nickel plating, sandblasting, power plating, wire drawing, polishing, anti-oxidation coating, etc.
Process: extrusion, skiving fin, stamping, die casting, precision CNC
 machining, drilling, milling, bending, soldering, etc
Packing: Retail packing
Factory: Yes

 

Payment Terms︰ Western Union,Paypal

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