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NT3ACA9-R8-50
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| Specification for Heat Sink |
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| Application |
3U Server&Up,workastion&Tower desktop solution |
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| CPU Socket |
LGA 2011 (Mounting pitch: 94*56mm) |
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| Application platform |
Intel® Sandy Bridge EP/EX Processors E5-2600 / E5-4600 (for Narrow ILM Mounting Only) |
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| Features |
1. Copper base+ Aluminum fin+5pcs U-shape Heat pipe |
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| 2. Bigger cooper base can absorb more thermal. |
| 3. 5PCS U-shape heat pipe and Aluminum fin make good cooling effect. |
| 4..Back plate can remove and replace, it can applied for all platforms. |
| Mounting way |
Screw+ Spring |
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| Size of Products |
105*95*125 mm |
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| Weight |
590 g（Note：If Weight of Heat sink ≥500g，
Pls do not install in CPU in case of damage. |
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| Thermally conductive material |
AD66（Thermally conductivity >4.0） |
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| Back Plate |
NA |
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