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LGA 1150/1151/1156 Bonded fin heat sink/heat pipe

  • LGA 1150/1151/1156 Bonded fin heat sink/heat pipe
  • LGA 1150/1151/1156 Bonded fin heat sink/heat pipe
Model No.︰NTCA-N2-01
Brand Name︰Coonong
Country of Origin︰China
Unit Price︰US $ 15 / pc
Minimum Order︰200 pc
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Product Description

Product Description
1 Product Size:89*89*21
2 Weight:188g
3 Material:Aluminum fin+heat pipes
Product Feature
1 Aluminum combined with copper,will make thermal effect more obvious.
2 Stacked aluminum fin,conductive material will make it more better.
Product Specification/Models
NT001N5-01
Application
Intel® Core™ i7-2600, i5-2500 series Intel® Core™ i3& i5,Xeon® Processor 3400 Series
Other Information
OEM ODM is welcome,10 years manufacture experience.
Application to LGA 1150/1151/1155/1156

Payment Terms︰Western Union,Paypal
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